Bump / RDL Planner

bumps: 144
assigned: 48
Σ trace: 12717 μm
Spec
die size (μm): 2000
bump pitch (μm): 150
bump diameter (μm): 80
edge keep-out (μm): 120
pad count: 48
Bump map
pad
bump (free)
bump (assigned)
RDL trace