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Wafer / Reticle Planner
Dies/wafer
Reticle pack
gross: 612
yield: 82.1%
good: 503
util: 90.2%
Wafer
diameter (mm): 300
edge exclusion (mm): 3.0
Die
width (mm): 10.00
height (mm): 10.00
scribe (mm): 0.10
Yield
D₀ (defects/cm²): 0.20
API
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